Off-Grid Communication in the mountains
In this project, I designed and built a water resistant 3D printed enclosure for a Heltec T114 Meshtastic node. The enclosure is rugged, lightweight, and purpose-built for field use.
Design
The enclosure needed to meet several key requirements:
- Water resistance
- Compact, handheld size
- Convenient access to buttons and charging port
- Durability against drops and rough handling
- Cost-effectiveness
I selected the Heltec T114 Meshtastic Node, which features an nRF5840-based LoRa module. Since I plan to pair it with a phone, battery life was prioritized over having a built-in screen. The Seeed Studio XIAO nRF52840 was also considered, but its charging circuit supports lower current.
The enclosure is made up of two main parts: a body that houses the electronics and battery, and a detachable lid with a recess for MagSafe magnets. Both components are 3D printed in MJF PA12S nylon for added strength. After printing, all surfaces were treated with a waterproof sealant. Assembly uses screws and a silicone gasket to ensure a watertight fit. Both the user button and USB port are designed to be waterproof.
While the silicone gasket improves water resistance, I do not recommend submerging the device. It offers better moisture protection than many other Meshtastic devices and should withstand rain or splashes, but it is not fully waterproof.


